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印刷电路板组装能力

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印刷电路板组装能力

北京希尔门业股份有限公司 Capabilities Introduction

  • 北京希尔门业股份有限公司 Capabilities Introduction

定制电路板是一个全服务快速旋转PCB制造商,位于菲尼克斯亚利桑那州,有能力制作您的原型和生产数量的印刷电路板.请随时与我们联系,看看我们是否能够制造您的董事会规格.发送给我们您的压缩文件(格伯rs-274x格式)和我们的销售团队将为您提供快速,准确的PCB报价.

 

Specifications Technology Notes
Number of Layers 1-40 Layers  
Board Materials FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Arlon AR350
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
Metal Core Materials
We keep these materials in stock.
If you need a material that is not
listed here,please contact us and
we can order it for you.
Stiffeners Thermo Set and PSA Based Aluminum
FR4
Stainless Steel
Polymide
 
Final PCB Thickness 2 Layer – Min .005” Max .250”
4 Layer – Min .015” Max .250”
6 Layer – Min .025” Max .250”
8 Layer – Min .031” Max .250”
10 Layer – Min .040” Max .250”
12 Layer – Min .047” Max .250”
14 Layer – Min .054” Max .250”
16 Layer – Min .062” Max .250”
18 Layer – Min .093” Max .250”
20 Layer – Min .125” Max .250”
22 Layer – Min .125” Max .250”
>24 Layer – Min .125” Max .250”
 
Core Thickness Min .0025”  
Maximum PCB Size 2 Layer 20” x 28”
Mulitlayer 16” x 26”
 
Minimum Conductor Space 0.003”  
Minimum Conductor Width 0.003”  
Minimum Drill Hole Size 0.006”  
Finish Plating / Surface Finishes HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and
Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
 
Finished Copper – Outer Layers 1oz Cu – Min .004” Trace/Space
2oz Cu – Min .005” Trace Space
3oz Cu – Min .008” Trace/Space
4oz Cu – Min .010” Trace/Space
5oz Cu – Min .012” Trace/Space
We can manufacture higher ounces
of copper depending on the specs.
Please let us know how much you
would like when sending us your
PCB specs.
Finished Copper – Inner Layers .5oz Cu – Min .004” Trace/Space
1oz Cu – Min .005” Trace/Space
2oz Cu – Min .006” Trace/Space
3oz Cu – Min .010” Trace/Space
4oz Cu – Min .012” Trace/Space
 
Inner Layer Clearances Min .008”
Minimum Finished Hole Size
Final Thickness <=.062” – .006’
Hole Final Thickness .150” – .014” Hole
Final Thickness .093” – .010” Hole
Final Thickness .200” – .018” Hole
Final Thickness .125” – .012” Hole
Final Thickness .250” – .020” Hole
 
Gold Fingers 1 to 4 edges  
Solder Mask Type Per IPC-SM-840
LPI Soldermask
Peelable Soldermask
 
Solder Mask Colors Green/Green
Matte White
Black/Black
Matte Clear
Blue Top and Bottom Mix
Red One or Both Sides Mix
 
Silkscreen Type Thermal Cure Epoxy Ink
LPI Ink
 
Silkscreen Colors White
Black
Yellow Top and Bottom Mix
Red One or Both Sides Mix
Blue
 
CNC Functions Scoring Edge to Edge Plated
Counter bores
Skip Scoring – .250” Spacing
Milling
30 or 60 Degree Score Angle
Blind and Buried Vias
30 to 100 Degree Countersink
Controlled Z Axis Route
15 to 45 Degree Gold Finger
Bevel Castellated Barrels
Counterbores Offset or
Recessed Beveling
Plated Countersinks
 
Other PCB Services Blind and Buried Vias
Plated Slots Specified Dielectric
Tented Vias Controlled Impedance
Solder mask Plugged Vias Via
Caps (Solder Mask)
Conductive Filled Vias
 
Quality / Testing Inspect to IPC Class III Continuity
Resistance – 10 to 20 Ohms
Net List Test per IPC-356D Isolation
Resistance – 2 to 30 Megaohms
Test Voltage – 100 to 250 Volts
Minimum SMT Pitch 0.5 mm
 
Tolerances PTH Hole Size – +/- .002”
Front to Back – +/- .002”
NPTH Hole Size – +/- .001”
Solder Mask – +/- .002”
Tooling Holes – +/- .001”
Hole to Pad – +/- .005”
 

联系方式
北京希尔门业股份有限公司

联系人: 成 先生

Tel: 13877778888

传真: 86-135-1111-2222

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